Explore real samples, processing steps, result verification and process selection.
Small MEMS devices can have an extremely thin aluminum layer on their bond pads. Conventional acid decapsulation may corrode this layer or cause pad loss. IDECAP uses MIP plasma with thin-pad and bond-connection preservation as the focus of sample preparation.
Read moreiMech Pro application images illustrate chip backside thinning, with a process path combining height measurement, leveling, visual positioning and suitable remaining-silicon-thickness metrology.
Read moreOverall and magnified flexible-board images illustrate observation of connections and fine traces after surface-material removal.
Read moreAssess component exposure, organic-coating changes and electrical condition separately, then qualify a staged MIP removal window through DOE.
Read moreLocal motherboard images illustrate Encap adhesive and PCB solder-mask removal, with inspection requirements for exposed regions, neighboring components and metal surfaces.
Read moreThe source records approximately 4 hours for an A13-marked sample and approximately 3 hours for another package, both using plasma only without laser preprocessing.
Read moreCombine small-area opening with peelable protective material to limit the processing region and support review of the target chip and neighboring structures.
Read moreExplore the challenges of stacked-die and memory-package decapsulation, two real application examples, and a combined iMech Pro and MIP route for subsequent die delayering.
Read moreA 3D package decapsulation case for semiconductor failure analysis: MIP plasma underfill removal after customer grinding, μbump inspection, and a proposed local workflow combining iMech Pro with iPlasma MIP.
Read moreTell us about the package, your analysis objective and the structures to preserve. Together, we can define a suitable decapsulation process.
