IDECAP at ICEPT 2026: Decapsulation and Delayering for Multi-layer Packages
At ICEPT 2026 in Xi’an, IDECAP focused on connecting decapsulation, local milling and plasma finishing for multi-layer package analysis.
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The latest from ICDECAP LIMITED: exhibitions, technical seminars and industry exchange.
IDECAP at IPFA 2026: MIP Plasma Decapsulation for Sensitive Structures
Returning to IPFA for a third consecutive year, IDECAP continued its focus on thin aluminum pads, stacked dies and fine-interconnect preparation.
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IDECAP at SEMICON China 2026: Connecting Decapsulation with Industry Needs
At SEMICON China 2026 in Shanghai, IDECAP focused on how laser, MIP plasma and mechanical preparation support semiconductor analysis.
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IDECAP at EPTC 2025: Decapsulation for Heterogeneous Integration
At EPTC 2025 in Singapore, IDECAP focused on preparation requirements for multi-chip structures, three-dimensional packages and heterogeneous integration.
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IDECAP at CPRIM 2025: Sample Preparation for Interconnect Reliability
At CPRIM 2025 in Guangzhou, IDECAP focused on access to underfill, fine interconnects and material interfaces for reliability analysis.
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IDECAP at ICEPT 2025: Decapsulation for Advanced Packages
At ICEPT 2025 in Shanghai, IDECAP focused on the connection between package architecture, material removal and access for failure analysis.
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IDECAP at IPFA 2025: From Fault Localization to Targeted Decapsulation
Returning to IPFA in Penang, IDECAP focused on translating fault-localization findings into controlled access to pads, bond wires and die surfaces.
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IDECAP at IPFA 2024: Our First Step into the IPFA Community
Our first IPFA participation in Singapore marked a new step in connecting chip decapsulation and sample preparation with international failure-analysis needs.
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Every solution starts with a sample.
Tell us about the package, your analysis objective and the structures to preserve. Together, we can define a suitable decapsulation process.