Event dates：2025-08-05 – 2025-08-07
Location：Shanghai, China
ICDECAP LIMITED participated in the 26th International Conference on Electronic Packaging Technology, held in Shanghai from 5 to 7 August 2025. ICEPT covered advanced packaging, materials and processes, interconnection technologies, and quality and reliability—subjects closely connected to sample preparation for package analysis.
Complex structures require a defined access path
Multi-chip packages and three-dimensional integration can place an analysis target at different depths and material interfaces. Before removal starts, the task is to identify the structure of interest and the appropriate access direction. Bond-wire inspection, local die exposure and interconnect examination require different preparation boundaries.
Evaluate bulk removal and finishing separately
IDECAP considers process selection by material and preparation stage. Laser or mechanical methods can be evaluated for initial access where appropriate, followed by MIP plasma treatment near structures requiring closer control. The combination should serve the inspection objective while keeping removal progression observable.
Judge preparation against the sample objective
A useful evaluation considers target exposure, residues that may obscure inspection and the condition of critical interconnects. These observations support decisions about the next analytical step. IDECAP continues to develop application support around such sample-specific requirements.
Explore IDECAP decapsulation solutions
Equipment and process options · Decapsulation applications · Discuss a sample evaluation