LASER PLASMA DECAP SYSTEM
Specifically designed and optimized for chip decapsulation
Incorporates both laser and plasma technologies, completely acid-free
Balances efficiency and safety, with typical decapsulation time ranging from 30 minutes to hours.
Fully automated operation, decapsulation with just a single button press.
Suitable for various wire materials such as gold,silver, copper, and aluminum.
Applicable to challenging products like SIP, High TG, GaAs,and other difficult-to-decapsulate devices.
Affordable
