LASER PLASMA DECAP SYSTEM

Speciticaly designedand optimrized for chip decapsulation

Incorporates both laser and plasma technologies,completely acid-free.

Balances efficiency and safety, with typical decapsulation time ranging from 30 to 60 minutes.

Fully automated operation, decapsulation with just a single button press.

Suitable for various wire materials such as gold,silver, copper, and aluminum.

Applicable to challenging products like SIP, High TG, GaAs,and other difficult-to-decapsulate devices.

Affordable