PLASMA DECAP SYSTEM
Specifically designed and optimized for chip decapsulation
No needfor CF4, minimal damage to wire bonds and surface passivation layers
Zeroselfplasing(non-charging) plasma etching to prevent electrostatic discharge
Atrosphericpressure low-temperature plasma etching, no damage to chip's electricalperforrmance and original data stored inside the chip
Equipped with a visualandmotion system, fully automated integration
Optional laser decapsulation function
Affordable
