Open the package. Preserve the evidence.
ICDECAP LIMITED (IDECAP) develops chip-decapsulation equipment for semiconductor failure analysis and sample preparation. Its systems combine laser opening, atmospheric-pressure MIP plasma, in-situ laser–plasma processing and precision mechanical grinding to access the structures that matter.
Start with the objective
Identify the die surface, bond interconnects, local failure area or backside structure before planning the opening.
Remove in stages
Separate bulk removal from fine processing near critical structures, with inspections between stages.
Keep results traceable
Link sample identity, processing conditions and images for review, comparison and process improvement.
Four capabilities. One connected preparation path.
Choose or combine processes to suit the materials, structure and analysis objective.
iPlasma Pro
Laser and atmospheric-pressure MIP, integrated in one system for in-situ decapsulation. Load the specimen and start: laser, plasma, cleaning, blow-drying and imaging run automatically. Validate the process, save the recipe and repeat with one-click operation for compatible specimens.
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iPlasma MIP
Atmospheric-pressure microwave-induced plasma (MIP) for fine organic-resin removal. Add acid-free finishing to your laser or mechanical preparation workflow to expose wires, pads and interconnects.
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iLaser
Coaxial vision for precise region selection. Draw the opening directly on the specimen image, set the laser conditions and remove encapsulant in stages. Create local access while retaining the required margin for fine decapsulation.
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iMech Pro
Precision milling, grinding, polishing and thinning for tasks requiring control of the removal path, local processing area and remaining thickness.
Explore systemCases
Explore real samples, processing steps, result verification and process selection.
Small MEMS Decapsulation: Protecting Thin Aluminum Pads with MIP
Small MEMS devices can have an extremely thin aluminum layer on their bond pads. Conventional acid decapsulation may corrode this layer or cause pad loss. IDECAP uses MIP plasma with thin-pad and bond-connection preservation as the focus of sample preparation.
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Mechanical thinning for chip backside and local analysis
iMech Pro application images illustrate chip backside thinning, with a process path combining height measurement, leveling, visual positioning and suitable remaining-silicon-thickness metrology.
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Local exposure on flexible boards: observing fine traces and connections
Overall and magnified flexible-board images illustrate observation of connections and fine traces after surface-material removal.
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The latest from ICDECAP LIMITED: exhibitions, technical seminars and industry exchange.
IDECAP at ICEPT 2026: Decapsulation and Delayering for Multi-layer Packages
At ICEPT 2026 in Xi’an, IDECAP focused on connecting decapsulation, local milling and plasma finishing for multi-layer package analysis.
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IDECAP at IPFA 2026: MIP Plasma Decapsulation for Sensitive Structures
Returning to IPFA for a third consecutive year, IDECAP continued its focus on thin aluminum pads, stacked dies and fine-interconnect preparation.
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IDECAP at SEMICON China 2026: Connecting Decapsulation with Industry Needs
At SEMICON China 2026 in Shanghai, IDECAP focused on how laser, MIP plasma and mechanical preparation support semiconductor analysis.
Read moreUnderstand the sample. Define the process.
Define the analysis objective
Confirm the observation area, structures to preserve and downstream analysis method.
Assess materials and process options
Consider the package, bond wires, fillers and sensitive surfaces when selecting the process.
Validate and review the sample
Capture stage images and inspect structures and residues to produce a reviewable result.
CLIENTS & GLOBAL DELIVERY
Working with industry leaders.
Selected customers and collaborating institutions across technology, manufacturing and research.
20+
Systems installed
Installed systems supporting decapsulation applications.
ISO 9000 · CE
Quality & compliance
Quality management and equipment certification.
Batch shipments
Built for delivery
Equipment shipment capability, from single systems to batches.
GLOBAL DELIVERY
Precision decapsulation. Delivered worldwide.
Systems have shipped to China, Vietnam, Malaysia and Singapore. With batch shipment and global delivery capabilities, we welcome more customers and distribution partners worldwide.
DELIVERY DESTINATIONS
China
Delivered
Vietnam
Delivered
Malaysia
Delivered
Singapore
Delivered