What is in-situ decapsulation?

After the specimen is loaded and the cycle is started, each decapsulation step runs automatically inside the same system. Operators do not need to transfer the specimen between laser, plasma and cleaning equipment. The automatic cycle runs from laser processing through final imaging without manual intervention.

How does one-click decapsulation work?

After product characterization and process validation, save the product recipe. For a subsequent compatible specimen, load it, recall the recipe and start. One-click operation reuses a validated process; if the package, materials or analysis objective changes, confirm the process and update the recipe first.

What are the benefits of MIP decapsulation?

MIP offers a controllable resin-removal route that reduces acid exposure and direct mechanical contact, progressively exposes delicate structures and aims to retain useful failure evidence. Selectivity depends on matching the recipe to the materials and validating it on representative samples.

What is microwave-induced plasma (MIP)?

MIP stands for Microwave-Induced Plasma. In chip decapsulation, microwave energy excites a process gas to generate reactive species, primarily oxygen radicals, that react with organic encapsulation resin. Gradual removal exposes the die, bond wires, pads and interconnect regions. ICDECAP uses an argon/oxygen process route focused on selective organic-resin removal. Inorganic fillers such as silica may require a separate cleaning step after the resin recedes. Organic materials, fillers and metals respond differently, so their endpoints must be assessed separately.

What is atmospheric-pressure MIP?

Atmospheric-pressure MIP uses microwave-induced plasma to remove organic encapsulation materials near ambient atmospheric pressure. No vacuum environment is required for decapsulation, simplifying sample loading, staged inspection and integration with other preparation steps.

Which decapsulation problems can MIP address?

MIP is useful when the goal is to expose fine metal features, thin pads, buried interconnects or foreign matter that may be affected by acid chemistry or continued mechanical removal. It provides a finishing step tailored to the materials and analysis objective. Stop at sufficient exposure. MIP can also remove organic protective layers that need to remain and may modify some material surfaces. Include gas recipe, power, temperature, exposure time and filler cleaning in DOE. Inspect at exposure and verify electrical preservation through measurement.

SYSTEMS & DECAPSULATION SOLUTIONS

Products

Find the right decapsulation path, from system selection to process planning.

OUR SYSTEMS

Four capabilities. One preparation workflow.

Laser, plasma, mechanical and combined processes.

In-situ Decapsulation System (Laser & Plasma)

iPlasma Pro

Laser and atmospheric-pressure MIP, integrated in one system for in-situ decapsulation. Load the specimen and start: laser, plasma, cleaning, blow-drying and imaging run automatically. Validate the process, save the recipe and repeat with one-click operation for compatible specimens.

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Plasma Decapsulation System

iPlasma MIP

Atmospheric-pressure microwave-induced plasma (MIP) for fine organic-resin removal. Add acid-free finishing to your laser or mechanical preparation workflow to expose wires, pads and interconnects.

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Laser Decapsulation System

iLaser

Coaxial vision for precise region selection. Draw the opening directly on the specimen image, set the laser conditions and remove encapsulant in stages. Create local access while retaining the required margin for fine decapsulation.

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Mechanical Decapsulation & Precision Preparation System

iMech Pro

Precision milling, grinding, polishing and thinning for tasks requiring control of the removal path, local processing area and remaining thickness.

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CHOOSE YOUR PROCESS

Solutions

Choose the right process for the structures that matter.

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First, define what you need to observe

Die and bonding regions

Establish an opening, then progressively finish material around bond wires, pads and the target surface.

Laser and plasma solutions →

Local failure regions

Connect electrical or image-based localization with the opening position, preserving stage images of the anomalous area.

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Backside and material stacks

Plan milling, grinding, polishing and remaining-thickness checks around the material layers.

Mechanical preparation solutions →

Process selection reference

Method	Primary task	Validation priorities
Laser	Bulk removal and local opening	Structure position, thermal effects, residue and processing margin
MIP plasma	Fine removal of organic material	Material response, filler residue and sensitive surfaces
Mechanical preparation	Milling, grinding, polishing and thinning	Flatness, load, debris and thickness control
Combined processing	Connect rough processing with finishing	Stage-transition boundaries, cleaning and intermediate review

Four stages of sample evaluation

01 Sample and objective

Record the package, dimensions, materials and failure state, and identify structures to preserve.

02 Path and boundaries

Define the opening direction, region, process combination and inspection points.

03 Process and observe

Capture stage images and inspect residue and critical structures.

04 Review and delivery

Compare results with the analysis objective and clarify application limits and review methods.

Frequently asked technical questions

Can packages with the same outline use the same parameters?

Appearance alone is insufficient. Changes in resin, filler, wire material and surface metals affect process response. Confirm conditions with representative samples.

Does an acid-free process eliminate all preparation effects?

Each process can still introduce thermal, mechanical or surface effects. Validate it against structural preservation requirements and downstream analysis needs.

How should board-level devices with underfill or encap be evaluated?

Consider adhesive materials, board warpage, neighboring components and solder joints. If original solder must remain, independently define remaining-thickness, residue and secondary-review acceptance methods.

Three-stage laser and plasma workflow

01 Open and retain a margin

Use laser processing for bulk removal, retaining material for subsequent processing near sensitive structures.

02 Locate and configure

Confirm the target region, energy, speed and cycle settings, and define the protected area.

03 Execute and review

Run the confirmed recipe, inspect residue and structures at agreed stages, and record the results.

Find a case by sample challenge

Process records and software example →

LET’S TALK

Every solution starts with a sample.

Tell us about the package, your analysis objective and the structures to preserve. Together, we can define a suitable decapsulation process.

Request sample assessment

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