Sample and analysis objective
For high-Tg packages, first identify the resin, filler, target chips and interconnects, then select a combination of bulk removal and local finishing.
| Item | Case information |
|---|---|
| Sample type | High-Tg package |
| Observation levels | Overall structure, target region and bonding details |
| Additional conditions needed | Resin and filler information, package thickness and wire material |
Processing record
The source includes package, overall internal-structure and local-detail images. It does not specify resin grade, measured Tg, processing time or batch data, so this case illustrates an application rather than quantified performance.
Actual sample images
Result review priorities
- Assess whether residual material obscures target structures.
- Check processing uniformity at boundaries between different materials.
- Develop recipes with representative samples; a high-Tg designation alone does not define a fixed process.