Event dates：2026-07-13 – 2026-07-16
Location：Marina Bay Sands, Singapore
ICDECAP LIMITED participated in IPFA 2026, the 33rd IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, held at Marina Bay Sands in Singapore from 13 to 16 July. Following our first participation in 2024, this was our third consecutive year at IPFA.
From thin aluminum pads to stacked packages
IDECAP continues to focus on decapsulation requirements for small MEMS devices, thin aluminum pads and stacked-die packages. Material removal must provide access while retaining conditions suitable for inspection. MIP plasma is one process option to evaluate for sensitive metallization, with the sequence and inspection stages defined around the sample.
Link decapsulation with subsequent delayering
After resin removal, some packages require further access to a lower die or local interconnect region. IDECAP can combine iMech Pro mechanical preparation with MIP finishing to evaluate local removal, residue treatment and intermediate inspection. Access direction is determined by the package architecture and the structures that must be retained.
Keep outcomes observable and the process traceable
Before-and-after images, target-exposure records and structural checks help make preparation results reviewable. Continued engagement with IPFA supports IDECAP’s work on equipment, sample evaluation and application support for semiconductor failure-analysis requirements.
Explore IDECAP decapsulation solutions
Equipment and process options · Decapsulation applications · Discuss a sample evaluation