Event dates：2026-08-05 – 2026-08-07
Location：Xi’an, China
ICDECAP LIMITED participated in the 27th International Conference on Electronic Packaging Technology, ICEPT 2026, held in Xi’an from 5 to 7 August. Organized by IMECAS, Xi’an Jiaotong University, IEEE EPS and CIE-EMPT, the conference addressed advanced packaging and heterogeneous integration.
Access multi-layer structures in defined stages
Investigation of stacked-die and memory packages often moves from an overall structural view to a selected internal level. Exposed bond wires, die edges and interface relationships help guide the next preparation decision. IDECAP emphasizes defining the target layer, local removal area and stopping point before proceeding.
Combine MIP decapsulation with mechanical delayering
MIP plasma treatment can be evaluated for resin removal and interconnect exposure. Where a lower region must be accessed, iMech Pro precision mechanical preparation can be followed by plasma finishing in suitable areas. Inspection between stages helps engineers track progress and adapt the route to the actual package.
Turn visible exposure into a useful analytical sample
The review should consider whether the target is accessible, critical interconnects remain observable and residues interfere with interpretation. Electrical testing or other analytical methods may be needed to establish the outcome for a specific device. IDECAP continues to develop decapsulation, delayering and application support for advanced packages and memory devices.
Explore IDECAP decapsulation solutions
Equipment and process options · Decapsulation applications · Discuss a sample evaluation