Event dates：2026-03-25 – 2026-03-27
Location：Shanghai New International Expo Centre, China
ICDECAP LIMITED participated in SEMICON China 2026, held from 25 to 27 March at the Shanghai New International Expo Centre. The event provided an industry-wide setting for following equipment requirements across semiconductor manufacturing, advanced packaging and failure analysis.
Connect equipment functions to an analytical task
For laboratories and semiconductor companies, decapsulation equipment must serve a specific investigation. IDECAP focuses on the removal boundary, preservation of critical structures, process observation and result review, connecting system selection with the work a sample needs.
Choose the route around the package
The current IDECAP portfolio includes the iPlasma Pro laser–plasma system, MIP plasma equipment, the iLaser laser decapsulation system and iMech Pro precision mechanical preparation equipment. Depending on package architecture, laser pre-opening, plasma treatment or mechanical delayering may be evaluated individually or in combination.
Support practical use beyond equipment selection
Installation, process development and operator training all contribute to day-to-day use. IDECAP continues to develop sample evaluation, equipment delivery and application support, and welcomes collaboration with customers and partners around specific packages and laboratory requirements.
Explore IDECAP decapsulation solutions
Equipment and process options · Decapsulation applications · Discuss a sample evaluation