Event dates：2025-08-05 – 2025-08-08
Location：Setia SPICE Convention Centre, Penang, Malaysia
ICDECAP LIMITED returned to IPFA for a second consecutive year in 2025. The 32nd IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits was held from 5 to 8 August at the Setia SPICE Convention Centre in Penang, Malaysia.
Turn localization results into an access boundary
Fault location, package layout and the next analytical step together determine the opening area. IDECAP emphasizes defining the region of interest, protected areas and inspection direction before approaching the target in stages. This links preparation decisions to the investigation that follows.
Evaluate sensitive interconnects carefully
Thin aluminum pads, fine bond wires and complex resin-covered structures require particular attention during material removal. MIP plasma decapsulation offers a route to evaluate when reducing dependence on wet-acid processing. Suitability depends on the encapsulant, metallization and sample condition.
Build a preparation record, not just a final image
A meaningful record includes the initial condition, intermediate exposure and final inspection details. Comparing residues, interconnect condition and target visibility across those stages helps engineers refine a process and decide whether the sample is ready for the next analytical step.
Explore IDECAP decapsulation solutions
Equipment and process options · Decapsulation applications · Discuss a sample evaluation