Event dates：2025-11-26 – 2025-11-27
Location：Guangzhou, China
ICDECAP LIMITED participated in CPRIM 2025, the Advanced Packaging Reliability Technology and Interconnect Materials Conference, held in Guangzhou on 26 and 27 November 2025. Organized by the Guangdong Integrated Circuit Industry Association and Future Semiconductor, the conference addressed packaging reliability and interconnect materials.
Interfaces shape the preparation task
Underfill, molding compounds and fine interconnects form a complex material system. Reaching the target is only part of the task: residues may obscure features, and preparation can affect the surfaces being examined. Clear access is especially important when inspecting microbumps and the spaces between them.
Combine local milling with plasma finishing
IDECAP can evaluate local mechanical preparation using iMech Pro followed by MIP plasma treatment of polymer residues. Where the sample calls for backside access, a local opening can be planned from the package underside rather than passing through a functional top die. Removal depth, stopping points and processing sequence are defined for the sample.
Create conditions for a reliable investigation
Preparation records and microscopic inspection should work together to document interfaces, interconnects and remaining material. Visual exposure and electrical performance require separate verification. Defined inspection stages help analysts assess whether preparation is supporting the reliability investigation.
Explore IDECAP decapsulation solutions
Equipment and process options · Decapsulation applications · Discuss a sample evaluation