Event dates：2025-12-02 – 2025-12-05
Location：Resorts World Convention Centre, Sentosa, Singapore
ICDECAP LIMITED participated in the 27th IEEE Electronics Packaging Technology Conference, EPTC 2025, held from 2 to 5 December at Resorts World Convention Centre, Sentosa, Singapore. The conference addressed advanced packaging, heterogeneous integration and packaging reliability.
Different regions require different preparation steps
Heterogeneous integration brings multiple dies, interconnect types and packaging materials into one device. Local resin removal, bond-region exposure and access to different levels may need separate preparation stages. IDECAP considers the target structure, access direction and inspection conditions together when evaluating a route.
Connect the stages into a practical workflow
Laser pre-opening, precision mechanical preparation and plasma treatment serve different roles. A sample-specific workflow may first create a local access window, then remove material near sensitive regions with intermediate observation. The sequence should preserve structures needed by the investigation and make subsequent analysis practical.
Connect equipment selection with application support
Complex packages call for equipment and process support to be evaluated together. Sample dimensions, materials, target location and preservation requirements provide a useful starting point. IDECAP supports this assessment by defining the preparation path and the observations needed to review its outcome.
Explore IDECAP decapsulation solutions
Equipment and process options · Decapsulation applications · Discuss a sample evaluation