Event dates：2024-07-15 – 2024-07-18
Location：Marina Bay Sands, Singapore
ICDECAP LIMITED participated in IPFA for the first time in 2024. The 31st IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits took place from 15 to 18 July at Marina Bay Sands in Singapore. This first participation began our continuing engagement with the international failure-analysis community.
Start with the analysis objective
Opening a package is one step in preparing a device for investigation. The important questions are where the target lies and what must happen next: optical inspection, electron microscopy, probing or further electrical assessment. Each objective calls for a different removal boundary and a different set of structures to preserve.
Prepare the sample while retaining evidence
IDECAP approaches decapsulation by first identifying the die, bond region and interconnects that matter to the investigation. Staged material removal and observation help engineers assess changes as access progresses. For delicate pads and fine bond wires, surface condition and interconnect integrity are part of the evaluation alongside the exposed area.
A foundation for continued engagement
Our first IPFA participation provided a starting point for following international sample-preparation requirements more closely. Discussing specific packages, documenting changes and feeding observations back into process development remain central to our application-support approach.
Explore IDECAP decapsulation solutions
Equipment and process options · Decapsulation applications · Discuss a sample evaluation