Explore real samples, processing steps, result verification and process selection.
Compare broad manual grinding with iMech Pro local opening for a published flip-chip micro-short case. Targeted access and MIP residue removal can help retain electrical connections for post-decapsulation retesting.
Read moreActual decapsulation images from thin-aluminum-layer samples support evaluation of surface integrity, contamination residue and downstream analysis requirements.
Read moreOverall, local and bonding-region images illustrate high-Tg package decapsulation, with material response and local residue as key evaluation points.
Read moreStaged opening around carbonized and locally damaged areas preserves observable features of die surfaces and bonding regions after electrical overstress.
Read moreStaged MIP plasma decapsulation for SiP packages integrating multiple dies, fine interconnects and passives, with DOE used to balance component exposure and protection of organic resistor coatings.
Read moreTell us about the package, your analysis objective and the structures to preserve. Together, we can define a suitable decapsulation process.
