Explore EOS carbonization, high-Tg packages, thin aluminum and flip-chip particles through opening images, localization and compositional evidence.
Compare broad manual grinding with iMech Pro local opening for a published flip-chip micro-short case. Targeted access and MIP residue removal can help retain electrical connections for post-decapsulation retesting.
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Staged opening around carbonized and locally damaged areas preserves observable features of die surfaces and bonding regions after electrical overstress.
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Overall, local and bonding-region images illustrate high-Tg package decapsulation, with material response and local residue as key evaluation points.
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Actual decapsulation images from thin-aluminum-layer samples support evaluation of surface integrity, contamination residue and downstream analysis requirements.
Read moreTell us about the package, your analysis objective and the structures to preserve. Together, we can define a suitable decapsulation process.
