Review underfill, Encap, solder-mask and flex-board applications, with separate criteria for residue, component condition and electrical requirements.
Local motherboard images illustrate Encap adhesive and PCB solder-mask removal, with inspection requirements for exposed regions, neighboring components and metal surfaces.
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Assess component exposure, organic-coating changes and electrical condition separately, then qualify a staged MIP removal window through DOE.
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Overall and magnified flexible-board images illustrate observation of connections and fine traces after surface-material removal.
Read moreTell us about the package, your analysis objective and the structures to preserve. Together, we can define a suitable decapsulation process.
