IDECAP / APPLICATION INSIGHTS

Mechanical preparation

Explore chip backside thinning and local analysis through height measurement, leveling, thickness verification and actual mechanical-removal images.

iMech Pro / Precision mechanical preparation

Mechanical thinning for chip backside and local analysis

iMech Pro application images illustrate chip backside thinning, with a process path combining height measurement, leveling, visual positioning and suitable remaining-silicon-thickness metrology.

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Every solution starts with a sample.

Tell us about the package, your analysis objective and the structures to preserve. Together, we can define a suitable decapsulation process.

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