Explore SiP, stacked die and 3D packages through images, process records and review priorities for multiple chips, deep bond wires and material stacks.
A 3D package decapsulation case for semiconductor failure analysis: MIP plasma underfill removal after customer grinding, μbump inspection, and a proposed local workflow combining iMech Pro with iPlasma MIP.
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Explore the challenges of stacked-die and memory-package decapsulation, two real application examples, and a combined iMech Pro and MIP route for subsequent die delayering.
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Staged MIP plasma decapsulation for SiP packages integrating multiple dies, fine interconnects and passives, with DOE used to balance component exposure and protection of organic resistor coatings.
Read moreTell us about the package, your analysis objective and the structures to preserve. Together, we can define a suitable decapsulation process.
