Thin aluminum layers: attention to sensitive metal surfaces
Actual decapsulation images from thin-aluminum-layer samples support evaluation of surface integrity, contamination residue and downstream analysis requirements.
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Cases
Explore real samples, processing steps, result verification and process selection.
High-Tg packages: evaluating complex molding compounds
Overall, local and bonding-region images illustrate high-Tg package decapsulation, with material response and local residue as key evaluation points.
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EOS carbonization: preserving clues in the failure region
Staged opening around carbonized and locally damaged areas preserves observable features of die surfaces and bonding regions after electrical overstress.
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SiP Decapsulation: MIP Plasma and Passive Component Protection
Staged MIP plasma decapsulation for SiP packages integrating multiple dies, fine interconnects and passives, with DOE used to balance component exposure and protection of organic resistor coatings.
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Every solution starts with a sample.
Tell us about the package, your analysis objective and the structures to preserve. Together, we can define a suitable decapsulation process.