CASE 02 / Microscopy

Case 02: Multi-Tier Bond-Wire Microscopy

Name: Case 02: Multi-Tier Bond-Wire Microscopy
Uploaded: 2026-09-24T16:25:23+00:00
Duration: PT30.7S
Description: Case 02 microscopy footage of bond-wire tiers, bonds and under-wire regions after plasma-only decapsulation of a stacked-die sample.

Case 02 microscopy footage of bond-wire tiers, bonds and under-wire regions after plasma-only decapsulation of a stacked-die sample.

IDECAP Technical Resources · Published 2026-09-25 · Updated 2026-10-30

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Inspecting multiple levels in motion

This approximately 31-second silent clip shows a cropped region of the sample in Case 02. Wire loops, bonds and visible residue are retained without retouching. Microscopic appearance and electrical continuity require separate review.

Read the MIP application and both cases →

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