How does coaxial vision support laser decapsulation?
iLaser uses coaxial vision to align observation and laser processing with the same target. Identify the package outline and target in the software image, then plan the laser region using the calibrated relationship between image and processing coordinates.
01
Align viewing and processing
Use the same target view to observe and select the region, making it easier to verify specimen position and the intended window.
02
Focus on local access
Use package-structure information to plan access to the die, bond region or specific location of interest.
03
Compare processing stages
Review the opening boundary, material removal and remaining allowance against the selected region.
How do you define the opening by drawing a box?
Draw a rectangular window directly on the coaxial image, adjust its position and size, and check it against the internal package structure. The confirmed software region defines the laser scan area. For local access, plan only the window needed to reach the target while protecting structures that must remain.
01 · Camera view
Locate the specimen
Observe the package outline and establish the area of interest.
02 · Draw the window
Selected region
Define the opening
Draw a rectangle over the image and confirm its position and size.
03 · Laser scanning
Selected region
Remove within the window
Scan the selected region in stages, leaving the required finishing margin.
Process schematic showing region selection and removal order. It is not a software screenshot or a scale drawing of a processed specimen.
Set the region and removal conditions separately. The drawn window defines the surface position and footprint. Laser power, scan settings, pass count and intermediate inspection determine how far material removal proceeds.
What are the steps in laser decapsulation?
The typical sequence is: secure the specimen → observe and focus → draw the window → set the process → scan in stages → inspect the result. The laser first creates controlled access; subsequent analysis or finishing depends on the structures exposed.
01
Load and define the target
Secure the specimen and confirm its orientation, analysis objective and structures to preserve.
02
Observe and focus
Adjust imaging and the focal plane for a clear view of the package surface and intended processing position.
03
Draw the opening
Select the window on the image and check its position and dimensions against the die and bond-wire layout.
04
Set the laser conditions
Confirm power, scan settings and pass count for the material and objective. Use representative specimens for initial validation when needed.
05
Remove material in stages
Scan the selected region progressively. Inspect the window between stages and retain a processing margin near sensitive structures.
06
Review and finish
Inspect the window, residue and surrounding structures; record the result, then proceed to microscopy or MIP resin removal as required.
Create access with laser. Approach the target with fine finishing.
iLaser focuses on local opening, thinning and bulk encapsulant removal. Region selection and staged processing leave an allowance for fine decapsulation. For an integrated automatic sequence covering laser, MIP, cleaning, blow-drying and imaging, explore iPlasma Pro.
01
Remove the bulk material
Create a window and shorten the material path to the target, supporting local access and package thinning.
02
Retain a finishing margin
Use the positions of the die, fine wires and pads to define where to stop and how to continue preparation.
03
Finish with MIP
Where delicate metal features need further exposure, follow with iPlasma atmospheric-pressure MIP to remove remaining organic resin.
Technical overview and sample evaluation
The existing published configuration is listed below. Confirm system selection and processing conditions against the package materials, target window and analysis requirements.
| Item | Published specification / application information |
|---|---|
| Laser power | 20 W |
| Laser wavelength | 1064 nm |
| Nominal working area | ≥ 250 × 250 mm |
| Nominal opening area | ≥ 100 × 100 mm |
The technical agreement defines the supplied configuration.
Start with your specimen and analysis objective.
Share the package and materials, target location and window dimensions, internal structure, die or interconnects to preserve, and subsequent microscopy or electrical-analysis requirements.
