LASER PLASMA DECAP SYSTEM
Speciticaly designedand optimrized for chip decapsulation
Incorporates both laser and MIP plasma technologies,completely acid-free.
Balances efficiency and safety, with typical decap speed about 200µm/h
Fully automated operation, decapsulation with just a single button press.
Suitable for various wire materials such as gold,silver, copper, and aluminum.
Applicable to challenging products like SIP, High TG, GaAs,and other difficult-to-decapsulate devices.
Affordable
